MediaTek announced that it has developed a flagship system-on-chip (SoC) using Taiwan Semiconductor Manufacturing Co.’s (TSMC) enhanced N2P process technology, with large-scale production scheduled for late 2026.
The collaboration continues the long-standing partnership between MediaTek and TSMC in producing high-performance and energy-efficient chipsets for mobile devices, computing, automotive, and data center applications.
TSMC’s 2nm technology is the first to use nanosheet transistor architecture. The N2P process is the next evolution in the 2nm family, designed to improve both performance and power efficiency.
“MediaTek’s innovations powered by TSMC’s 2nm technology underscores our industry leadership, as we continue to push forward with the most advanced semiconductor process technologies available for a variety of devices and applications,” said Joe Chen, president of MediaTek. “Our long history of close collaboration with TSMC has led to advancements in solutions for our global customers, offering the highest performance and power efficiency from the edge to the cloud.”
Compared with TSMC’s current-generation N3E process, the N2P process is expected to deliver up to an 185 performance increase at the same power, around 36% power reduction at the same speed, and a 1.2 times increase in logic density.
“N2P represents a significant step forward in the nanosheet era for TSMC, demonstrating our relentless dedication to fulfilling our customers’ needs, tuning and improving our technologies to deliver energy-efficient computing capability,” said Dr. Kevin Zhang, SVP of business development and global sales and deputy co-COO of TSMC. “Our ongoing collaboration with MediaTek focuses on maximizing enhanced performance and power capabilities across a wide range of applications.”