MediaTek is unveiling its latest innovations in artificial intelligence (AI) and wireless connectivity at Mobile World Congress 2025, showcasing technologies that lay the foundation for future 6G networks.
The chipmaker is presenting advancements in hybrid computing, satellite communications, and its new M90 5G Advanced modem, along with updates on its Dimensity smartphone and automotive chips.
“We’re pushing forward industry-leading connectivity and AI applications through high-quality products and global standardization, which create significant new opportunities to enrich everyday living for more people around the world,” said Joe Chen, president of MediaTek.
Advancing wireless technology
MediaTek is demonstrating its hybrid computing technology, which integrates cloud and edge computing to reduce delays in AI processing and enhance data privacy. The company has collaborated with Nvidia, Intel, and G REIGNS to showcase applications in generative AI (GenAI), privacy protection, and resource management.
Another highlight is MediaTek’s Sub-Band Full Duplex (SBFD) technology, which improves how wireless networks handle data transmission. By reducing interference in unpaired frequency bands, this technology enhances uplink coverage and lowers latency, which is essential for future 6G applications. MediaTek is working with Keysight to test this advancement.
The company is also presenting its new Ultra Power-Efficient Envelope Assisted RFFE system, which improves power amplifier efficiency by 25%. This innovation helps devices consume less power and manage heat better, while expanding bandwidth capabilities.
M90 5G Advanced modem and AI antenna
MediaTek’s new M90 5G Advanced modem promises speeds of up to 12Gbps and improved power efficiency. The modem supports 3GPP Release 17 standards and is prepared for the upcoming Release 18 specifications. The company is showing how the M90, using an Ericsson network, can achieve a 10Gbps connection in real-world conditions.
A key feature of the M90 modem is its Smart AI Antenna, which adjusts its signal based on how a device is being held. The antenna system improves connectivity without the need for external sensors, ensuring a more reliable connection in different usage scenarios. MediaTek is showcasing this feature in collaboration with Anritsu.
Expanding AI beyond smartphones
MediaTek is introducing an AI-powered gateway that extends GenAI capabilities to various connected devices. This technology allows smart homes and other connected systems to benefit from AI features without relying solely on cloud-based processing. The company’s AI gateway also prioritizes data privacy by handling more tasks locally.
At the event, MediaTek is displaying new customer premises equipment (CPE) solutions that improve 5G connectivity. These devices use three transmission antennas (3TX) to enhance uplink performance by nearly double and feature low-latency technology that reduces network delays by over 20 times.
Advancements in satellite connectivity
MediaTek is continuing its work on 5G-Advanced Non-Terrestrial Network (NTN) technology, focusing on Ku-band satellite communications. The company recently conducted a field trial using OneWeb’s low Earth orbit (LEO) satellites. This advancement aims to bring broadband connectivity to remote areas and improve global coverage.
Automotive and high-performance computing
In the automotive sector, MediaTek is highlighting its Dimensity Auto platform, which includes an advanced multimedia system and an 8K display for in-car entertainment. The system is designed to support AI-driven applications in next-generation vehicles.
The company is also showcasing the Dimensity 9400 smartphone chip, featuring AI-powered photography enhancements, ray-traced gaming, and advanced video playback capabilities.
For data centers and AI computing, MediaTek is presenting its 224G SerDes technology, which enhances high-speed data transfer. The solution is designed for AI applications, networking infrastructure, and hyperscale computing environments.