MediaTek, Intel advance partnership to bring 5G to next-generation of PCs

Chipmaker MediaTek and global technology firm Intel have reached a milestone in the development and certification of the former’s 5G modem data card for next-generation PC experiences.

MediaTek’s T700 5G modem, which will be used to bring 5G connectivity to Intel-powered PCs, completed 5G standalone (SA) calls in real world test scenarios. Intel has progressed on system integration, validation and developing platform optimizations for a superior user experience and is readying co-engineering support for its OEM partners.

“With Intel’s deep expertise in the PC space and our groundbreaking 5G modem technology, we will redefine the laptop experience and bring consumers the best 5G experiences,” said Joe Chen, president, MediaTek.

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The MediaTek T700 modem supports non-standalone (NSA) and standalone (SA) Sub-6 5G network architectures to deliver consistently faster speeds and more reliable connectivity. Whether consumers are at home or on the go, they can browse, stream and play games at ultra-fast 5G speeds. MediaTek’s modem is also said to be highly power efficient to extend the battery life of laptops so consumers can go longer in-between charges. MediaTek is rolling out its advanced 5G technology across the PC, mobile, home, auto and IoT segments to make super-fast connectivity accessible to everyone.

“A successful partnership is measured by execution, and we’re excited to see the rapid progress we are making with MediaTek on our 5G modem solution with customer sampling starting later this quarter. Building on our 4G/LTE leadership in PCs, 5G is poised to further transform the way we connect, compute and communicate. Intel is committed to enhancing those capabilities on the world’s best PCs,” said Chris Walker, Intel corporate vice president and general manager of Mobile Client Platforms.

The first laptops enabled by the MediaTek and Intel 5G modem solution are expected in early 2021.

The two companies are also working with Fibocom on the development of M.2 modules optimized for Intel client platforms. Fibocom will provide operator certification and regulatory support, as well as lead 5G M.2 module manufacturing, sales and distribution. The first PC products are expected to be available in early 2021.