MediaTek launched the Dimensity 1050 system-on-chip (SoC), its first mmWave 5G chipset that will power the next generation of 5G smartphones. It promises to deliver seamless connectivity, displays, gaming and power efficiency.

The Dimensity 1050 combines mmWave 5G and sub-6GHz to fluidly migrate between network bands, and is built on the ultra-efficient TSMC 6nm production process with an octa-core CPU. Supporting 3CC carrier aggregation on sub-6 (FR1) spectrum and 4CC carrier aggregation on mmWave (FR2) spectrum, the Dimensity 1050 will be capable of delivering up to 53% faster speeds and greater reach to smartphones compared to LTE + mmWave aggregation alone. The SoC integrates two premium Arm Cortex-A78 CPUs with speeds reaching 2.5GHz and the latest Arm Mali-G610 graphics engine.

“The Dimensity 1050, and its combination of sub-6GHz and mmWave technologies, will deliver end-to-end 5G experiences, uninterrupted connectivity, and superior power efficiency to meet everyday user demands,” said CH Chen, deputy general manager of Wireless Communications Business Unit at MediaTek. “With faster, more reliable connections, and advanced camera technology this chip delivers powerful features to help device makers to differentiate their smartphone product lines.”

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In addition to 5G optimizations, the Dimensity 1050 offers Wi-Fi optimizations alongside MediaTek’s HyperEngine 5.0 gaming technology to ensure lower-latency connections with the new tri-band – 2.4GHz, 5GHz and 6GHz – that extends game time and performance. Additionally, high-end UFS 3.1 storage and LPDDR5 memory ensure ultra-fast data streams to accelerate apps, social feeds and faster FPS in games.

The Dimensity 1050 support True Dual 5G SIM (5G SA + 5G SA) and Dual VoNR, offers super-fast 144Hz Full HD+ displays with intense, and vibrant colors through MediaTek’s MiraVision 760. It also has dual HDR video capture engine, enabling users to simultaneously stream with the front and rear cameras. Its noise reduction for superb low-light photos and MediaTek’s APU 550 improves AI camera actions. It features Wi-Fi 6E support for superior power efficiency and 2×2 MIMO antenna brings faster, more reliable connections.