MediaTek and AMD announced a collaboration to co-engineer industry-leading Wi-Fi solutions, starting with the AMD RZ600 Series Wi-Fi 6E modules containing MediaTek’s new Filogic 330P chipset. The Filogic 330P chipset will power next-generation AMD Ryzen-series laptops and desktop PCs in 2022 and beyond, delivering fast Wi-Fi speeds with low latency and less interference from other signals.

To optimize the AMD RZ600 Series Wi-Fi 6E modules with a focus on delivering seamless connectivity experiences for customers, AMD and MediaTek developed and certified PCIe and USB interfaces for modern sleep states and power management, which are vital elements of modern customer experiences. The optimization process included stress testing and ensuring compatibility standards, which may ultimately reduce development time for OEM customers.

Filogic 330P supports the latest connectivity standards of 2×2 Wi-Fi 6 (2.4/5GHz) and 6E (6GHz band up to 7.125GHz), along with Bluetooth® 5.2 (BT/BLE). The high throughput chipset is ultra-fast with support for up to 2.4Gbps connectivity, including support for the new 6GHz spectrum at 160MHz channel bandwidth. The chipset also integrates MediaTek’s power amplifier (PA) and low noise amplifier (LNA) technology to help optimize power consumption and reduce design footprint which enables the Filogic 330P chipset to be embedded in laptops of all sizes.

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The AMD RZ600 Series Wi-Fi 6E modules expand AMD’s Wi-Fi capabilities, bringing excellent connectivity solutions to OEMs and end users, whether they are playing the latest interactive games, working remotely, or completing a big project.

AMD RZ600 Series Wi-Fi 6E Modules Specifications

• Wi-Fi Module
• Wi-Fi Specs
• M.2 Slots
• AMD RZ616 Wi-Fi 6E module
• Wi-Fi 6E 2×2
• 160MHz Wi-Fi Channels
• PHY rate up to 2.4Gbps
• M.2 2230 and 1216
• AMD RZ608 Wi-Fi 6E module
• Wi-Fi 6E 2×2
• 80MHz Wi-Fi Channels
• PHY rate up to 1.2Gbps
• M.2 2230

Filologic

On the other hand, the new MediaTek Filogic 130 and Filogic 130A system-on-chips (SoCs) both integrate a microprocessor (MCU), AI engine, Wi-Fi 6 and Bluetooth 5.2 subsystems, and a power management unit (PMU) into a single chip.

Filogic 130A also integrates an audio digital signal processor to allow device makers to easily add voice assistants and other services into their products. These all-in-one solutions deliver energy-efficient, reliable, and high-performance connectivity in small form factor designs that are ideal for a wide range of IoT devices.

Filogic 130 and Filogic 130A both support 1T1R Wi-Fi 6 connectivity and dual-band 2.4GHz and 5GHz, along with advanced Wi-Fi features such as target wake time (TWT), MU-MIMO, MU-OFDMA, quality of service (QoS), and WPA3 Wi-Fi security. To ensure that users’ Wi-Fi connectivity remains reliable even when Bluetooth devices are in use at the same time, the solutions support advanced Wi-Fi and Bluetooth coexistence.

Both single-chip solutions integrate an Arm Cortex-M33 microcontroller which is supported by embedded RAM and external flash and an integrated front-end module (iFEM) that supports low noise amplifier (LNA) and power amplifier (PA) functionality. The Filogic 130A also integrates an integrated HiFi4 DSP for more accurate far-field voice processing, always-on microphone capability with voice activity detection, and trigger word support.

Filogic 130 and Filogic 130A are designed to maximize power efficiency in the smallest and lowest-power form factor, allowing devices to achieve Energy Star and Green Appliance ratings and certifications. The solutions also support secure boot and hardware crypto engines for robust security capabilities and support a variety of interfaces including general-purpose IOs such as SPI, I2C, I2S, IR input, UART, AUXADC, PWM, and GPIO interfaces to make the design process easier.