Vertiv, a global provider of critical digital infrastructure and continuity solutions, has launched a new cooling solution designed to support both air and liquid cooling needs for artificial intelligence (AI) and high-performance computing (HPC) systems.
Called the Vertiv CoolLoop Trim Cooler, the system is built for hybrid-cooled or liquid-cooled data centers, including those in regions with varying climate conditions.
The Vertiv CoolLoop Trim Cooler is designed to work with high-density, liquid-cooled environments. It supports supply water temperatures up to 40°C and cold plate operations at 45°C, helping improve efficiency and reduce energy use. According to Vertiv, the system can cut annual cooling energy consumption by as much as 70% and save up to 40% more space compared to traditional setups.
“Asia’s rapid digital transformation and AI-driven growth demand innovative cooling solutions that can handle high heat densities while improving energy efficiency,” said Cheehoe Ling, vice president of product management Asia at Vertiv. “This future-friendly solution enables our customers to support AI and HPC infrastructure strategies while achieving significant space savings and simplifying installation.”
Using low global warming potential
The system includes straightforward water connections, allowing for quick integration with Vertiv’s CoolChip CDU for direct-to-chip cooling. It can also connect to immersion cooling systems, making it flexible and adaptable to different high-density environments.
The Vertiv CoolLoop Trim Cooler uses a low global warming potential (GWP) refrigerant and has a scalable cooling capacity of nearly 3 megawatts in its air-cooled setup. It also meets the 2027 EU F-GAS regulation, helping businesses stay ahead of future compliance requirements without costly upgrades.
With this new addition, Vertiv aims to help data centers meet the growing cooling demands brought by AI and HPC workloads, while also cutting down on energy use and carbon emissions.