IBM has connected and cooled two cryogenic modules in a single environment, completing a test for its planned fault-tolerant quantum computer.
The modular cooling system is designed to support hundreds of connected quantum chips. IBM plans to use the technology in IBM Quantum Starling, which it expects to deliver in 2029.
Fault-tolerant quantum computers are designed to detect and correct errors while calculations are running. Reaching that stage requires advances in processors, cooling systems, software, and error correction.
IBM said the first two operating modules measure more than 8 feet tall and 8 feet wide when combined. Initial tests showed that they could cool to 4 Kelvin, the temperature of liquid helium, in less than five days. The system later reached below 15 millikelvin, close to absolute zero.
These extremely low temperatures are needed to keep quantum processors working properly.
Each module provides up to 12 times more wiring space than IBM’s most widely used quantum systems. The added room allows IBM to create more connections within and between quantum chips.
The box-shaped modules can be placed closely together and connected through IBM’s “L-coupler” technology. The couplers allow separate quantum chips to exchange information and operate as parts of a larger computer.
IBM plans to use L-couplers by 2027 to connect several processors into a quantum computer with at least 1,000 programmable qubits. Qubits are the basic units used by quantum computers to process information.
Later this year, IBM will install IBM Quantum Nighthawk processors in the cooling modules for further performance tests. Each module is expected to hold thousands of qubits when Starling is completed.
“Bringing fault-tolerant quantum computers to industries depends on several fundamental advances,” said Jay Gambetta, director of IBM Research and IBM Fellow. “The successful connection and operation of these cryogenic modules signals a leap forward in that direction and will accelerate our progress alongside continued innovation in quantum hardware, software, and algorithms.”
IBM said the modular design would allow parts of the cooling system to be tested and improved separately, helping speed up development.
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