Xiaomi has unveiled the Xiaomi 18 Fold, its first mid-size foldable smartphone and the first Xiaomi flagship powered by its new in-house XRING O3 processor.
The XRING O3 gives Xiaomi more control over performance, battery life, AI features, and how its devices work with Xiaomi HyperOS.
Built using a 3-nanometer process, the XRING O3 has a 10-core CPU, 16-core GPU, and dedicated AI hardware. Xiaomi said the processor delivers 60% faster CPU performance while consuming 25% less power than its previous-generation chip.
The Xiaomi 18 Fold is roughly the size of a passport when closed. It has a 5.38-inch outer display for one-handed use and opens into a 7.58-inch tablet-like screen. Both screens have the same aspect ratio, allowing content to move more naturally between them.
Xiaomi HyperOS supports two- and three-way split-screen layouts for working across several apps. The phone weighs 219 grams and measures 5.02 millimeters thick when unfolded.
For photography, the device has a 200-megapixel Leica main camera and a 50-megapixel Leica periscope telephoto camera. It also carries a 6,000mAh battery with 67-watt wired and 50-watt wireless charging.
Xiaomi introduced a reinforced hinge, two layers of ultra-thin glass, and a 7000-series aluminum frame to improve durability. The company claims the inner display has 258% greater impact resistance than its previous foldables.
The XRING O3 also powers the new Xiaomi Pad 9 Pro Max, a 13.3-inch productivity tablet with a 3.4K display, 12,000mAh battery, and 120W fast charging.
The Xiaomi 18 Fold starts at 10,999 yuan in China.
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